Targeting key processes in surface mount technology and printed circuit board manufacturing such as solder paste inspection, component placement, dispensing reinforcement, and AOI inspection, providing high-stability automation equipment. The high-speed standard pick-and-place equipment is suitable for precision placement scenarios including odd-form components, shielding covers, stiffeners, and RFID chips, with placement accuracy of ±15μm, compatible with various feeding methods such as tape & reel, tray, and waffle tray, meeting both low-volume high-mix and high-volume mass production requirements. The high-speed dispenser achieves precise dispensing of red glue, underfill glue, conductive adhesive, and underfill material, with a direct-drive Z-axis featuring 10μm concentricity combined with closed-loop pressure control, ensuring consistent adhesive path trajectory and volume stability, eliminating issues of missing or insufficient adhesive. The AOI series inspection equipment covers pre-reflow and post-reflow inspection, accurately identifying defects such as missing components, misalignment, wrong polarity, solder bridging, tombstoning, and insufficient solder.