Covers the entire automated process from precision placement, micro-dispensing, high-speed fastening to online inspection for consumer electronic products such as smartphones, tablets, wearable devices, and TWS earphones. The high-speed standard pick-and-place equipment is specifically designed for high-precision placement scenarios including FPC flexible board reinforcement, camera modules, fingerprint recognition chips, and microphones, with placement accuracy of ±15μm, UPH up to 8,000 units, and changeover time <15 minutes, adapting to multi-variety flexible production needs. The high-speed dispenser features a direct-drive Z-axis with 10μm concentricity and a closed-loop pressure control system, enabling processes such as border dispensing, thermal adhesive coating, and underfill filling, with adhesive volume consistency within ±1%, eliminating issues like stringing and adhesive overflow. The high-speed fastening and assembly system supports multi-axis simultaneous fastening with torque accuracy ±3%, suitable for efficient assembly of structural components such as middle frames, screens, and battery covers, with optional vision guidance for automatic compensation of missed screws.