Targeting key processes in the semiconductor packaging and testing field such as wafer-level packaging, chip placement, underfill filling, precision dispensing, and AOI inspection, providing a high-speed, high-precision automation equipment matrix. The high-speed standard pick-and-place equipment features a direct-drive Z-axis design with 10μm concentricity, achieving precise placement of tiny components such as chips and passive components, with placement accuracy of ±10μm and UPH exceeding 6,000 units, meeting the efficient production requirements of QFN, BGA and other package types. The high-speed dispenser supports non-contact jetting and needle dispensing, with minimum dispensing volume reaching the nanoliter level, combined with VISIONPRO+ intelligent vision algorithm for real-time positioning compensation, perfectly addressing micro-fluid control challenges such as underfill filling, silver paste dispensing, and dam-and-fill applications.